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毕业论文-特种汽车CAN网络子节点研制，共103页，39774字
本文阐述了特种车辆CAN网络子节点的整个研制过程。这项研制工作是“特种车辆CAN网络”的重要组成部分之一。论文按照标准工程项目的研发流程，从背景调研、方案论证、硬件设计、软件设计和系统测试五个方面，详细介绍了子节点模块的整个研制进程以及各项硬件特性和软件方案。调试结果表明，所研制的子节点模块完成了预期功能，各项指标达到了项目要求。本文对于特种车辆CAN网络的用户以及从事相关技术研发工作的工程技术人员有较高参考价值。
The thesis describes the complete R&D procedure of the Special Vehicle CAN Sub-Node. This task is one of the key elements of “Special Vehicle CAN” program. Following the standard R&D procedure of engineering program, the thesis describes the R&D procedure as well as hardware feature and software system in five aspects: background research, project argumentation, hardware design, software design and system test. The test results verify that the Sub-Node we design performances as expected, with all key indicators meet the requirement. The thesis would be valuable for the client of Special Vehicle CAN and developers engaged in related R&D area.
目录
第 1 章 引言 .................................................................................................................1
1.1 CAN 总线概述 ......................................................................................................1
1.1.1 CAN 发展背景简介 .........................................................................................1
1.1.2 CAN 总线的特性 .............................................................................................2
1.1.3 CAN 总线结构 .................................................................................................3
1.2 MC9S12DG128 微控制器 ....................................................................................4
1.2.1 MC9S12DG128 主要特性 ...............................................................................4
1.2.2 MC9S12DG128 片内结构 ...............................................................................5
1.2.3 MCU 最小系统 ................................................................................................7
第 2 章 课题项目与子节点设计概述 .........................................................................9
2.1 项目介绍 ..............................................................................................................9
2.1.1 课题项目背景 .................................................................................................9
2.1.2 CAN 网络拓扑结构 .........................................................................................9
2.1.3 系统预期功能 ...............................................................................................10
2.1.4 技术指标 .......................................................................................................11
2.2 子节点设计概述 ................................................................................................11
2.2.1 子节点功能 ...................................................................................................11
2.2.2 硬件技术要求 ...............................................................................................12
2.2.3 子节点模块结构 ...........................................................................................14
2.2.4 各模块的实现方案 .......................................................................................15
第 3 章 硬件系统设计 ...............................................................................................17
3.1 硬件设计概述 ....................................................................................................17
3.1.1 硬件设计流程 ...............................................................................................17
3.1.2 硬件系统架构 ...............................................................................................17
3.2 电路模块设计 ....................................................................................................19
3.2.1 温度传感器模块与仿真 ...............................................................................19
3.2.2 油量传感器模块设计与仿真 .......................................................................23
3.2.3 开关信号处理电路设计 ...............................................................................26
3.2.4 电源模块设计 ...............................................................................................27
3.3 子节点电路原理图 ............................................................................................28
3.3.1 MCU 最小系统 ..............................................................................................28
3.3.2 信号处理模块 ...............................................................................................29
3.3.3 电源模块 .......................................................................................................33
3.3.4 CAN 模块 .......................................................................................................34
3.3.5 继电器模块 ...................................................................................................35
3.4 子节点 PCB 设计与制作...................................................................................35
3.4.1 子节点 PCB 板的结构 ..................................................................................35
3.4.2 PCB 板电源和地的处理 ................................................................................36
3.4.3 PCB 硬件焊接与调试 ....................................................................................39
第 4 章 软件系统设计 ...............................................................................................41
4.1 软件设计概述 ....................................................................................................41
4.1.1 软件设计框架 ...............................................................................................41
4.1.2 软件开发环境 CodeWarrior 4.6....................................................................42
4.2 硬件信号读取程序设计 ....................................................................................42
4.2.2 0-1 数字量读取 ..............................................................................................43
4.2.3 A/D 转化.........................................................................................................43
4.2.4 方波脉冲计数 ...............................................................................................48
4.3 CAN 数据包发送 ................................................................................................53
4.3.1 MSCAN 模块 .................................................................................................53
4.3.2 CAN 收发程序 ...............................................................................................55
4.4 硬件驱动程序整合 ............................................................................................57
第 5 章 系统调试运行与结论 ...................................................................................61
5.1 硬件性能测试 ....................................................................................................61
5.1.1 PCB 工作电位测试 ........................................................................................61
5.1.2 光耦模块测试 ...............................................................................................62
5.1.3 温度传感器模块测试 ...................................................................................62
5.1.4 油量传感器模块测试 ...................................................................................63
5.2 软件调试 ............................................................................................................65
5.2.2 数字量读取 ...................................................................................................65
5.2.3 A/D 电压转化 .................................................................................................66
5.2.4 方波脉冲计数 ...............................................................................................67
5.3 子节点综合调试 ................................................................................................67
5.4 结论 ....................................................................................................................68
5.5 后续工作展望 ....................................................................................................69
插图索引 .....................................................................................................................71
表格索引 .....................................................................................................................75
参考文献 .....................................................................................................................77
致谢 .....................................................................................................................79
声明 .....................................................................................................................81
附录 A 外文资料的书面翻译 ....................................................................................83
在学期间参加课题的研究成果 ...............................................................................103